UCSB SoC Design and Test Lab

Taming Emerging Devices’ Variation and Reliability Challenges with Architectural and System Solutions

Submitted by Yuyang Wang on Wed, 03/13/2019 - 16:37

Y. Wang, Shao, L., Lastras-Montano, M. Angel, and Cheng, K. - T., “Taming Emerging Devices’ Variation and Reliability Challenges with Architectural and System Solutions”, in 32nd IEEE International Conference on Microelectronic Test Structures (Invited Paper), Kita-Kyushu City, Japan, 2019.

Process Design Kit and Design Automation for Flexible Hybrid Electronics

Submitted by Leilai Shao on Tue, 02/12/2019 - 09:16

T. - C. Huang, Lei, T., Shao, L., Sivapurapu, S., Swaminathan, M., Li, S., Bao, Z., Cheng, K. - T., and Beausoleil, R., “Process Design Kit and Design Automation for Flexible Hybrid Electronics”, in Design Automation And Test in Europe (Invited Paper), Florence, Italy, 2019.

Ultra-thin Skin Electronics for High Quality and Continuous Skin-Sensor-Silicon Interfacing

Submitted by Leilai Shao on Tue, 02/05/2019 - 14:16

L. Shao, Li, S., Lei, T., Huang, T. - C., Beausoleil, R., Bao, Z., and Cheng, K. - T., “Ultra-thin Skin Electronics for High Quality and Continuous Skin-Sensor-Silicon Interfacing”, in 56th Design Automation Conference, (Accepted), 2019.

Compact Modeling of Thin Film Transistors for Flexible Hybrid IoT Design

Submitted by Leilai Shao on Tue, 02/05/2019 - 14:10

L. Shao, Lei, T., Huang, T. - C., Li, S., Chu, T. - Y., Wong, M., Beausoleil, R., Bao, Z., and Cheng, K. - T., “Compact Modeling of Thin Film Transistors for Flexible Hybrid IoT Design”, IEEE Design & Test, no. Special Issue: Circuits and Systems for VLSI Internet-of-Things (IoT) Devices, 2019.

Bidirectional Tuning of Microring-Based Silicon Photonic Transceivers for Optimal Energy Efficiency

Submitted by Yuyang Wang on Tue, 11/27/2018 - 16:01

Y. Wang, M. Seyedi, A., Hulme, J., Fiorentino, M., Beausoleil, R. G., and Cheng, K. - T., “Bidirectional Tuning of Microring-Based Silicon Photonic Transceivers for Optimal Energy Efficiency”, in 24th Asia and South Pacific Design Automation Conference (ASP-DAC), Tokyo, Japan, 2019.

Fully Printed Organic Pseudo-CMOS Circuits for Sensing Applications

Submitted by Leilai Shao on Wed, 06/20/2018 - 09:37

L. Shao, Chu, T. - Y., Tao, Y., and Cheng, K. - T. Tim, “Fully Printed Organic Pseudo-CMOS Circuits for Sensing Applications”, in 1st IEEE International Flexible Electronics Technology Conference (IFETC), Ottawa, Canada, 2018.

Mining Mutation Testing Simulation Traces for Security and Testbench Debugging

Submitted by Nicole Fern on Mon, 11/20/2017 - 11:27

N. Fern and Cheng, K. - T. Tim, “Mining Mutation Testing Simulation Traces for Security and Testbench Debugging”, in International Conference on Computer-Aided Design (ICCAD), 2017.

Robust Design and Design Automation for Flexible Hybrid Electronics

Submitted by Leilai Shao on Sun, 11/19/2017 - 17:01

T. - C. Huang, Shao, L., Lei, T., Beausoleil, R. G., Bao, Z., and Cheng, K. - T. Tim, “Robust Design and Design Automation for Flexible Hybrid Electronics”, in International Symposium on Circuits and Systems (ISCAS), 2017.

Energy-Efficient Channel Alignment of DWDM Silicon Photonic Transceivers

Submitted by Yuyang Wang on Sun, 11/19/2017 - 14:56

Y. Wang, M. Seyedi, A., Wu, R., Hulme, J., Fiorentino, M., Beausoleil, R. G., and Cheng, K. - T., “Energy-Efficient Channel Alignment of DWDM Silicon Photonic Transceivers”, in Design, Automation and Test in Europe (DATE), Dresden, Germany, 2018.

Process Design Kit for Flexible Hybrid Electronics

Submitted by Leilai Shao on Sun, 11/19/2017 - 14:50

L. Shao, Huang, T. - C., Lei, T., Bao, Z., Beausoleil, R., and Cheng, K. - T. Tim, “Process Design Kit for Flexible Hybrid Electronics”, in in 23rd Asia and South Pacific Design Automation Conference (ASP-DAC), (Invited Paper), 2018.