R. Wu, Chen, C. - H., Fedeli, J. - M., Fournier, M., Cheng, K. - T. Tim, and Beausoleil, R. G.,
“Compact models for carrier-injection silicon microring modulators”,
Optics Express, vol. 23, no. 12, pp. 15545-15554, 2015.
OE-RingModel.pdf (1.06 MB) R. Wu, Chen, C. - H., Huang, T. - C. Jim, Cheng, K. - T. Tim, and Beausoleil, R. G.,
“20 Gb/s Carrier-Injection Silicon Microring Modulator with SPICE-Compatible Dynamic Model”, in
Photonics in Switching Conference (PS), Florence, France, 2015.
PS2015_PostDeadline.pdf (1.51 MB) R. Wu, Chen, C. - H., M. Seyedi, A., Huang, T. - C. Jim, Fiorentino, M., Beausoleil, R. G., and Cheng, K. - T. Tim,
“Large-Signal Model for Small-Size High-Speed Carrier-Injection Silicon Microring Modulator”, in
OSA Integrated Photonics Research, Silicon, and Nano-Photonics Conference (IPR), Vancouver, Canada, 2016.
IPR2016_Rui_v6.pdf (2.15 MB) C. - T. Wu, Cheng, K. - T. Tim, Zhu, Q., and Wu, Y. - L.,
“Using visual features for anti-spam filtering”, in
Image Processing, 2005. ICIP 2005. IEEE International Conference on, 2005, vol. 3, p. III–509.
R. Wu, Chen, C. - H., Fedeli, J. - M., Fournier, M., Beausoleil, R. G., and Cheng, K. - T. Tim,
“Compact Modeling and System Implications of Microring Modulators in Nanophotonic Interconnects”, in
International Workshop on System-Level Interconnect Prediction (SLIP) , San Francisco, CA, 2015.
SLIP2015.pdf (569.23 KB) C. H. - P. Wen, Wang, L. C., and Cheng, K. - T. Tim,
“Simulation-based functional test generation for embedded processors”,
Computers, IEEE Transactions on, vol. 55, pp. 1335–1343, 2006.
Y. Wang, M. Seyedi, A., Wu, R., Hulme, J., Fiorentino, M., Beausoleil, R. G., and Cheng, K. - T. Tim,
“Energy-Efficient Channel Alignment of DWDM Silicon Photonic Transceivers”, in
Design, Automation and Test in Europe (DATE), Dresden, Germany, 2018.
DATE18_YW_camera_ready_v4.pdf (1.45 MB) Y. Wang, Shao, L., Lastras-Montano, M. Angel, and Cheng, K. - T. Tim,
“Taming Emerging Devices’ Variation and Reliability Challenges with Architectural and System Solutions”, in
32nd IEEE International Conference on Microelectronic Test Structures (Invited Paper), Kita-Kyushu City, Japan, 2019.
Invited-3-Cheng.pdf (522.21 KB)