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| Telecommunication network reliability (1) | temperature 20 degC to 50 degC (1) | Temperature measurement (2) |
| temporal correlations (1) | ternary content-addressable memory (TCAM) (1) | test circuitry (1) |
| test cost reduction (1) | test data analytics (1) | test data compression (1) |
| test prediction (1) | test program (1) | test quality improvement (1) |
| test quality optimization (1) | test response compaction (1) | test response compaction. (1) |
| test selection (1) | test time reduction (1) | Testing (2) |
| TFT technology (1) | TFT-LCD displays (1) | Thermal degradation (1) |
| thermal stress (1) | thermal stresses (1) | thermo-optical effects (2) |
| thermo-stress-optic behavior (1) | thin film circuits (1) | thin film transistor (1) |
| thin film transistors (3) | three-dimensional integrated circuits (1) | time division multiplexing (1) |
| time-multiplexed (2) | time-multiplexed assertion checking (1) | Timing (2) |
| timing aware test selection method (1) | timing errors (1) | timing sensitivity (1) |
| TiO2-clad silicon waveguides (1) | TiO2-Si (2) | titanium compounds (3) |
| TMAC implementation (1) | TMOC checker (1) | Topology (1) |
| Training (1) | transfer function characterization (1) | transfer functions (1) |
| Transistors (1) | transition fault (TF) (1) | transition fault (TF). (1) |
| transition fault detection (2) | triple-error-correcting Golay code (1) | Trojan horses (2) |
| TV (1) | | |
